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| page <1> absolute maximum ratings at ta=25c package dimensions: internal circuit diagram: all dimensions are in mm tolerance: 0.25mm the slope angle of any pin may be 5 max parameter symbol rating unit power dissipation - pre segment p d 78 mw pulse current (1/10 duty cycle, 0.1ms pulse width) - per chip i fp 100 ma forward current - per chip i f 30 ma reverse (leakage) current - per chip ir 100 a reverse voltage - per chip v r 5 v operating temperature range topr. -25 to +85 c storage temperature range tstg. -40 to +100 c soldering temperature tsol. dip soldering: 260c for 5sec. hand soldering: 350c for 3 sec. 703-0188: www.element14.com www.farnell.com www.newark.com v1.0 28/06/12 10 segment light bar
page <2> electrical & optical characteristics: parameter symbol condition min. typ. max. unit luminous intensity - per segment iv if=10ma / dot 1.7 3.4 mcd forward voltage vf if=20ma / dot 2.1 2.6 v peak wavelength p if=20ma / dot 567 nm dominant wavelength d if=20ma / dot 572 nm reverse current - per chip (leakage current - per chip) ir vr=5v 100 a spectrum line halfwidth ? if=20ma / dot 30 deg response time t 250 nm note: customers special requirements are also welcome. typical electrical & optical characteristics curves: (25c ambient temperature unless otherwise noted) www.element14.com www.farnell.com www.newark.com v1.0 28/06/12 10 segment light bar |
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